I’m packing my bags soon for another trip across the pond for our annual, Autodesk-internal geekfest, TechX 2023.
This year’s event is being held in Dallas, Texas, a city I haven’t visited in perhaps 20 years. I’m sure a lot has changed – we’ll see!
In any case TechX isn’t about the venue – or even about the technical content, which, while often really interesting, is also watchable remotely during and after the event – as much as the chance to (re)connect with people. In that sense it’s similar to the Autodesk University experience, which is really about in-person connection for those lucky enough to be there physically.
With many people at Autodesk working remotely, these days – even though the pandemic is over, as a company we’re doubling down on flexible (hybrid) working – these events are even more important. I, for one, am very much looking forward to it.
During the event I’ll be presenting alongside my colleague, Dagmara Szkurlat, about our current research focus. Given the looming deadline for AU class proposals, I’ll also be spending some time crafting a few of those, too. I’ll share more from Dallas!